1 產品
| 圖片 | 型號 | 價格 | 數量 | 庫存 | 製造商 | 描述 | Series | Part Status | Packaging | Mounting Type | Applications | Package / Case | Type | Supplier Device Package | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,819
有現貨
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Maxim Integrated | IC TDM OVER PACKET 484HSBGA | - | Not For New Designs | Tray | Surface Mount | Data Transport | 484-BGA Exposed Pad | TDM (Time Division Multiplexing) | 484-HSBGA (23x23) |
