- Part Status :
3 產品
| 圖片 | 型號 | 價格 | 數量 | 庫存 | 製造商 | 描述 | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Interface | Supplier Device Package | Number of Circuits | Voltage - Supply | Function | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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獲得報價 |
819
有現貨
|
Maxim Integrated | IC TDM/PACKET TRANSPORT 676BGA | - | Discontinued at Digi-Key | Tray | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) | ||
|
|
|
3,407
有現貨
|
Maxim Integrated | IC TDM PACKET 32PORT 676PBGA | - | Not For New Designs | Tray | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) | |||
|
|
|
1,334
有現貨
|
Maxim Integrated | IC TDM OVER PACKET 676-BGA | - | Active | Tray | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) |
